印制电路词汇

一、综合词汇
1、印制电路：printedcircuit
2、印制线路：printedwiring
3、印制板：printedboard
4、印制板电路：printedcircuitboard(PCB)
5、印制线路板：printedwiringboard(PWB)
6、印制元件：printedcomponent
7、印制接点：printedcontact
8、印制板装配：printedboardassembly
9、板：board
10、单面印制板：single-sidedprintedboard(SSB)
11、双面印制板：double-sidedprintedboard(DSB)
12、多层印制板：mulitlayerprintedboard(MLB)
13、多层印制电路板：mulitlayerprintedcircuitboard
14、多层印制线路板：mulitlayerpritedwiringboard
15、刚性印制板：rigidprintedboard
16、刚性单面印制板：rigidsingle-sidedprintedborad
17、刚性双面印制板：rigiddouble-sidedprintedborad
18、刚性多层印制板：rigidmultilayerprintedboard
19、挠性多层印制板：flexiblemultilayerprintedboard
20、挠性印制板：flexibleprintedboard
21、挠性单面印制板：flexiblesingle-sidedprintedboard
22、挠性双面印制板：flexibledouble-sidedprintedboard
23、挠性印制电路：flexibleprintedcircuit(FPC)
24、挠性印制线路：flexibleprintedwiring
25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard
26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted
27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard
28、齐平印制板：flushprintedboard
29、金属芯印制板：metalcoreprintedboard
30、金属基印制板：metalbaseprintedboard
31、多重布线印制板：mulit-wiringprintedboard
32、陶瓷印制板：ceramicsubstrateprintedboard
33、导电胶印制板：electroconductivepasteprintedboard
34、模塑电路板：moldedcircuitboard
35、模压印制板：stampedprintedwiringboard
36、顺序层压多层印制板：sequentially-laminatedmulitlayer
37、散线印制板：discretewiringboard
38、微线印制板：microwireboard
39、积层印制板：buile-upprintedboard
40、积层多层印制板：build-upmulitlayerprintedboard(BUM)
41、积层挠印制板：build-upflexibleprintedboard
42、表面层合电路板：surfacelaminarcircuit(SLC)
43、埋入凸块连印制板：B2itprintedboard
44、多层膜基板：multi-layeredfilmsubstrate(MFS)
45、层间全内导通多层印制板：ALIVHmultilayerprintedboard
46、载芯片板：chiponboard(COB)
47、埋电阻板：buriedresistanceboard
48、母板：motherboard
49、子板：daughterboard
50、背板：backplane
51、裸板：bareboard
52、键盘板夹心板：copper-invar-copperboard
53、动态挠性板：dynamicflexboard
54、静态挠性板：staticflexboard
55、可断拼板：break-awayplanel
56、电缆：cable
57、挠性扁平电缆：flexibleflatcable(FFC)
58、薄膜开关：membraneswitch
59、混合电路：hybridcircuit
60、厚膜：thickfilm
61、厚膜电路：thickfilmcircuit
62、薄膜：thinfilm
63、薄膜混合电路：thinfilmhybridcircuit
64、互连：interconnection
65、导线：conductortraceline
66、齐平导线：flushconductor
67、传输线：transmissionline
68、跨交：crossover
69、板边插头：edge-boardcontact
70、增强板：stiffener
71、基底：substrate
72、基板面：realestate
73、导线面：conductorside
74、元件面：componentside
75、焊接面：solderside
76、印制：printing
77、网格：grid
78、图形：pattern
79、导电图形：conductivepattern
80、非导电图形：non-conductivepattern
81、字符：legend
82、标志：mark
二、基材：
1、基材：basematerial
2、层压板：laminate
3、覆金属箔基材：metal-cladbadematerial
4、覆铜箔层压板：copper-cladlaminate(CCL)
5、单面覆铜箔层压板：single-sidedcopper-cladlaminate

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6、双面覆铜箔层压板：double-sidedcopper-cladlaminate
7、复合层压板：compositelaminate
8、薄层压板：thinlaminate
9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate
10、金属基覆铜层压板：metalbasecopper-cladlaminate
11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm
12、基体材料：basismaterial
13、预浸材料：prepreg
14、粘结片：bondingsheet
15、预浸粘结片：preimpregnatedbondingsheer
16、环氧玻璃基板：epoxyglasssubstrate
17、加成法用层压板：laminateforadditiveprocess
18、预制内层覆箔板：masslaminationpanel
19、内层芯板：corematerial
20、催化板材：catalyzedboard,coatedcatalyzedlaminate
21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate
22、涂胶无催层压板：adhesive-coateduncatalyzedlaminate
23、粘结层：bondinglayer
24、粘结膜：filmadhesive
25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm
26、无支撑胶粘剂膜：unsupportedadhesivefilm
27、覆盖层：coverlayer(coverlay)
28、增强板材：stiffenermaterial
29、铜箔面：copper-cladsurface
30、去铜箔面：foilremovalsurface
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